KOLTECH covers underfloor machining, removed-wheelset machining, tandem layouts and automatic wheel diagnostics.
Underfloor wheel lathes reprofile wheels while the wheelset remains under the vehicle. Variants address different rolling-stock and workshop requirements.
Two-machine arrangements increase throughput where fleet geometry and maintenance flow justify parallel/tandem wheel machining.
Above-floor wheelset lathe for removed wheelsets and wheel-shop / manufacturing workflows.
Automatic wheel diagnostics plus CNC/measuring-system/software/tooling upgrades connect condition measurement with machining and long-term machine support.
Machine wheels without removing the wheelset from the vehicle.
Use a wheelset shop / above-floor workflow.
Increase production where the fleet and process justify it.
Measure wheelset condition before/after machining.
Add compatible disc work where the configured machine supports it.
Upgrade controls, measurement, hydraulics, software and tooling over the machine lifecycle.
This selector narrows the machine architecture before model-level engineering begins.
Choose underfloor machining when wheels should be reprofiled without removing the wheelset from the vehicle.
KOLTECH's differentiation becomes strongest when diagnostics and controlled machining are treated as one process. Better condition data can support more deliberate material removal and verification.
| Workflow | Best-fit architecture | Core question |
|---|---|---|
| Vehicle-on-track maintenance | TUP underfloor | Can we machine without wheelset removal? |
| Central wheelset shop | TUU1250 | Is the wheelset already removed? |
| Large homogeneous fleet | Tandem TUP | Does throughput justify parallel/tandem machining? |
| Condition-led maintenance | VIDIgo + lathe | Can measurement improve machining decisions? |
KOLTECH is a current CBP principal with direct relationship development. The controlled project evidence does not currently establish a named delivered Indonesian KOLTECH lathe, so the page sells the technology on its actual capabilities and lifecycle architecture rather than borrowed proof.